{
  "annotation_id": "740db6d8-b6d5-4a3b-a8e7-c7921eabf352",
  "date_created": "2026-02-17T05:53:15.222000Z",
  "date_modified": "2026-02-17T05:53:15.222000Z",
  "file_hash": "e00fb96847d5c23606c7ead7636093d1ed83e2e352287f5f1cdcf6f012a79993",
  "private": false,
  "record": {
    "abstract": "In chip-to-chip communication, terahertz waves provide a promising approach to achieve high data capacity with improved energy efficiency, effectively bridging the gap between electrical and optical domains. By realizing this potential, all-dielectric waveguides have emerged as high-speed interconnects, offering broad bandwidth and low-loss characteristics while being compatible with planar integration. This paper reviews different types of terahertz all-dielectric waveguides, including photonic-crystal and effective-medium-clad structures, and highlights recent progress in implementing these platforms to develop various passive functional devices, paving the way for high-speed operation and large-scale integration in terahertz systems.",
    "arxiv_id": "2601.08515",
    "authors": [
      "Nguyen H. Ngo",
      "Weijie Gao",
      "Masayuki Fujita"
    ],
    "categories": [
      "physics.app-ph"
    ],
    "journal_ref": "IEICE Tech. Rep., vol. 125, no. 293, MWPTHz2025-66, pp. 1-4, Dec. 2025",
    "license": "http://creativecommons.org/licenses/by/4.0/",
    "title": "Advances in All-Silicon Waveguides for Terahertz Integration",
    "url": "https://arxiv.org/abs/2601.08515",
    "version": "v1"
  },
  "schema_id": "dorsal/arxiv",
  "source": {
    "execution_id": "1dd2cfe5-e39f-4b9e-a7f7-d3ee58cb0af6",
    "id": "arXiv Dataset",
    "type": "Model",
    "variant": "snapshot-2026-01-17",
    "version": "0.1.0"
  },
  "user_id": 1000002
}